1.Fast and one-stop service
2.Accept PCB design,clone and OEM/ODM service.
4.Quote within 24 hours with China and US office.
PCB Techinecal Capacity
Mass production: 2~58 layers / Pilot run: 64 layers
Mass production: 394mil (10mm) / Pilot run: 17.5mm
FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc.
Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness
UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size
Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Max. Panel Size
1150mm × 560mm
HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.
PCBA technical Capacity
Position accuracy:20 um
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
Max. component height::25mm
Max. PCB size:680×500mm
Min. PCB size:no limited
PCB thickness:0.3 to 6mm
Max. PCB width:450mm
Min. PCB width: no limited
Component height:Top 120mm/Bot 15mm
Metal type :part, whole, inlay, sidestep
Metal material:Copper , Aluminum
Surface Finish:plating Au, plating sliver , plating Sn
Air bladder rate:less than20%
Max. PCB size:800X600mm
ICT,Probe flying,burn-in,function test,temperature cycling
U-C group limited with customers to provide them with the highest-quality IC assembly services to achieve their goals. Our flexibility is in meeting customer requirements and our superior customer service. We help companies introduce their new products to market in the fastest time possible by providing high quality, quick-turn assembly.We assembles ICs in prototype and production volumes to help you qualify your designs and provide quality samples to your customers.